Abstract

Polycrystalline cadmium telluride (CdTe) X-ray photodetector with advanced performance was fabricated in a Schottky diode form by direct thermal deposition (evaporation) on pixelized complementary metal oxide semiconductor (CMOS) readout panel. Our CdTe X-ray detector shows such a variety of benefits as relatively low process temperature, low cost, low operation voltage less than 40 V, and higher sensitivity and spatial resolution than those of commercial a-Se detectors. CdTe has cubic Zinc Blende structure and maintains p-type conduction after growth in general. For low voltage operation, we succeeded in Cl doping at all stage of CdTe film deposition, and as a result, hole concentration of p-type CdTe was reduced to ~1012 cm−3 from ~1015 cm−3, and such concentration reduction could enable our Schottky diode with Ti electrode to operate at a reverse bias of less than 40 V. Our CdTe Schottky diode/CMOS pixel array as a direct conversion type imager demonstrates much higher resolution X-ray imaging in 7 × 9 cm2 large scale than that of CsI/CMOS array, an indirect conversion imager. To our limited knowledge, our results on polycrystalline CdTe Schottky diode/CMOS array would be very novel as a first demonstration of active pixel sensor system equipped with directly deposited large scale X-ray detector.

Highlights

  • Commercial direct type active matix X-ray imager consists of amorphous selenium (a-Se) photodetector and a-Si TFT switch in sensor system; the a-Se detector/a-Si TFT combination is classified www.nature.com/scientificreports/

  • Our results on polycrystalline cadmium telluride (CdTe) Schottky diode/CMOS array would be very novel as a first demonstration of active pixel sensor (APS) system equipped with directly deposited large scale X-ray detector. (According to Table S1, overall properties such as electron-hole pair creation energy (W) and mobility × carrier life time product in our polycrystalline CdTe material are shown and regarded quite desirable)

  • CdTe film growth on Ti appears successful as seen in Fig. 1d where Ti film pattern is added on Al pixel electrode

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Summary

Image Sensor

Silah Lee[1], Jin Sung Kim[1], Kyeong Rok Ko1, Gun Hwan Lee[2], Dong Jin Lee[3], Dong wook Kim[3], Jin Eui Kim[3], Ho Kyung Kim 4, Dong Woon Kim4 & Seongil Im1. Our CdTe Schottky diode/CMOS pixel array as a direct conversion type imager demonstrates much higher resolution X-ray imaging in 7 × 9 cm[2] large scale than that of CsI/CMOS array, an indirect conversion imager. Our results on polycrystalline CdTe Schottky diode/CMOS array would be very novel as a first demonstration of active pixel sensor system equipped with directly deposited large scale X-ray detector. Our CdTe Schottky diode/CMOS array demonstrates much higher resolution X-ray imaging in 7 × 9 cm[2] large scale as a direct conversion APS imager than that of CsI/CMOS array, an indirect conversion imager. Our results on polycrystalline CdTe Schottky diode/CMOS array would be very novel as a first demonstration of APS system equipped with directly deposited large scale X-ray detector. Our results on polycrystalline CdTe Schottky diode/CMOS array would be very novel as a first demonstration of APS system equipped with directly deposited large scale X-ray detector. (According to Table S1, overall properties such as electron-hole pair creation energy (W) and mobility × carrier life time product (μτ) in our polycrystalline CdTe material are shown and regarded quite desirable)

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