Abstract
Bonding between silver and ceramics like Al2O3, ZrO2, MgO, AlN, sapphire or quartz glass is obtained by a “liquid phase bonding process” based on the pseudo-binary eutectic between Ag and CuO (at 1 mol %). It melts 15 K below the melting point of pure Ag in air. Excellent wetting between the eutectic liquid and the ceramic surfaces gives mechanically strong, reliable bonds. The bonding mechanism is similar to the well known direct copper bonding (DCB)-process. Our new process is simple and works at 1219±2 K in plain air. It therefore has the potential of massive cost reductions compared to the more complicated DCB-process.
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