Abstract
Contact resonance spectroscopy measurements on thin film deposits based on a tactile piezoresistive silicon microcantilever probe are described. Direct-reading capability during linescans across selectively thin-film-deposited areas of an artefact surface is demonstrated using a phase-locked-loop circuit (PLL). Good agreement found with frequency-sweep measurements followed by line-shape analysis (LSA) including non-linear damping confirm the high potential of the proposed method for non-destructive inline manufacturing-process metrology.
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