Abstract

We measure power dissipation in phase change memory (PCM) devices by scanning Joule expansion microscopy (SJEM) with ∼50 nm spatial and 0.2 K temperature resolution. The temperature rise in the Ge2Sb2Te5 (GST) is dominated by Joule heating, but at the GST-TiW contacts it is a combination of Peltier and current crowding effects. Comparison of SJEM and electrical measurements with simulations of the PCM devices uncovers a thermopower of ∼350 μV K−1 and a contact resistance of ∼2.0 × 10−8 Ω m2 (to TiW) for 25 nm thick films of face centered-cubic crystalline GST. Knowledge of such nanometer-scale Joule, Peltier, and current crowding effects is essential for energy-efficient design of future PCM technology.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.