Abstract
We present integration of singulated micron-sized light emitting diodes (micro-LEDs) directly onto a silicon CMOS drive chip using a transfer printing method. An 8x8 micro-LED device array with individual control over each pixel is demonstrated with modulation bandwidths up to 50 MHz, limited by the large modulation depth of the driver chip. The 2 kHz frame rate CMOS driver also incorporates a Single Photon Avalanche Diode device thus allowing detection and transmission functionality on a single integrated chip. Visible light communications at data rates up to 1 Mbps, and time-of-flight ranging with cm-scale resolution are demonstrated using this hybrid integrated system.
Highlights
Arrays of micron-sized light emitting diodes on sapphire substrates can be directly integrated with their electronic drive chips using standard flip-chip bonding processes [1,2], producing individually addressable, high-speed sources for visible light communications (VLC) [3] and spatial navigation [4] in compact, chip-scale systems
We have demonstrated the direct integration of an 8x8 array of GaN-based micro-LEDs onto CMOS circuitry by micro-transfer printing, without any adhesion-enhancement layer
The CMOS-driven micro-LED modulation bandwidth of 48 MHz at 165 A/cm2 is limited by the CMOS driver and its high modulation depth output
Summary
Arrays of micron-sized light emitting diodes (micro-LEDs or μLEDs) on sapphire substrates can be directly integrated with their electronic drive chips using standard flip-chip bonding processes [1,2], producing individually addressable, high-speed sources for visible light communications (VLC) [3] and spatial navigation [4] in compact, chip-scale systems. An alternative integration technique is micro-transfer printing (μTP), where individual thin film devices are removed from their growth substrate and transferred onto a host chip, using an accurate form of pick and place [7] This technique allows the population of the host substrate with devices only where required, removing issues associated with a flip-chipped substrate. This method has been shown to be able to handle micro-LED chips as small as 8x15 μm, with extremely high-yield [8], and has been used to realise, for example, micro-displays on flexible substrates [9] or optical gain on silicon photonics [10]. Demonstration of data communications and time-of-flight (ToF) ranging operation, using the SPAD as a receiver, is presented
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