Abstract
Recently, the fabrication of electronics-related components via direct ink writing (DIW) has attracted much attention. Compared to the conventionally fabricated electronic components, DIW-printed ones have more complicated structures, higher accuracy, improved efficiency, and even enhanced performances that arise from well-designed architectures. The DIW technology allows directly print materials on a variety of flat substrates, even a conformal one, well suiting them to applications such as wearable devices and on-chip integrations. Here, recent developments in DIW printing of emerging components for electronics-related applications are briefly reviewed, including electrodes, electronic circuits, and functional components. The printing techniques, processes, ink materials, advantages, and properties of DIW-printed architectures are discussed. Finally, the challenges and outlooks on the manufacture of 3D structured electronic devices by DIW are outlined, pointing out future designs and developments of DIW technology for electronics-related applications. The combination of DIW and electronic devices will help to improve the quality of human life and promote the development of science and society.
Highlights
As the development of high technology, traditional electronic products with the disadvantages of bulky size, single function and high cost are gradually replaced by novel electronic ones that are portable and powerful
The results showed direct ink writing (DIW) permitted printing patterns with a similar quality to the screen printing process but with a better regularity of the edges of printing lines
DIW technology provides a new strategy for the preparation of electronic devices, which can print structures with specific functions more conveniently and quickly, offering more possibilities for human beings to play their subjective activity and realize the transformation from mind to reality
Summary
The fabrication of electronics-related components via direct ink writing (DIW) has attracted much attention. Compared to the conventionally fabricated electronic components, DIW-printed ones have more complicated structures, higher accuracy, improved efficiency, and even enhanced performances that arise from well-designed architectures. The DIW technology allows directly print materials on a variety of flat substrates, even a conformal one, well suiting them to applications such as wearable devices and on-chip integrations. Recent developments in DIW printing of emerging components for electronics-related applications are briefly reviewed, including electrodes, electronic circuits, and functional components. The printing techniques, processes, ink materials, advantages, and properties of DIW-printed architectures are discussed. The challenges and outlooks on the manufacture of 3D structured electronic devices by DIW are outlined, pointing out future designs and developments of DIW technology for electronics-related applications.
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