Abstract
This paper presents a study of the solvent-based precursors (inks) derived from composites of polyethylene oxide, graphene flakes and micro-scale spherical Eutectic Gallium Indium (EGaIn) fillers and their processing through direct-ink-writing (DIW). The presented studies focus on the influence of EGaIn fillers on ink rheology, DIW process mechanisms as well as electrical conductivity of the printed structures. The results show that EGaIn fillers vary the ink rheology towards a more elastic behavior with lower extensional viscosity. This leads to ink filaments capable of withstanding large extensional strains during DIW, forming continuous prints even when printing speed is higher than ink flow speed, and producing features with line width smaller than the nozzle diameter. Electrical conductivity of the prints reduces with increasing strain due to the deformation of the liquid EGaIn fillers along the printing direction. These findings can be utilized to control the DIW process and the properties of the conductive polymer composites.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
