Abstract
The visualization of mass storage controllers and flash memory chips in the USB2.0, USB3.0 and solid state device (SSD) devices was performed using a thermo-elastic optical indicator microscopy system. Heat distributions corresponding to the various operation/loading parameters such as writing block sizes were analyzed, which was showed device behavior on heating. Direct measurements of the temperature by a thermocouple were implemented in order to investigate the operation thermal states of the devices under test (DUTs) in the idle regime. Heat temperature differences dependence on loading block size (0.25kB – 64MB) was found for all DUTs. In order to explain the heat variation dependence on block size a series of measurements of the DUTs transfer rates were performed. The data transfer rate is drastically changed depending on the transferred block size (8B – 128MB), (0.2kB/s – 7MB/s), (0.3kB/s – 21MB/s), (2kB/s – 92MB/s) and (3.7kB/s – 222MB/s) for USB2.0, USB3.0, HDD, and SSD, respectively.
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