Abstract
Two typical layered ternary compounds, Ti 3SiC 2 and Ti 3AlC 2, were joined directly by solid-state diffusion bonding method. By various bonding tests at 1100–1300 °C for 30–120 min under 10–30 MPa, and characterizing the microstructure and diffusion reactive phases of the joints by scanning electron microscopy (SEM), energy dispersive X-ray spectrometer (EDS), transmission electron microscopy (TEM) and X-ray diffraction (XRD), the optimal condition for direct joining of Ti 3SiC 2 and Ti 3AlC 2 was obtained. Strong joints of Ti 3SiC 2/Ti 3AlC 2 can be achieved via diffusion bonding, which is attributed to remarkable interdiffusion of Si and Al at the joint interface. The shear strength of the Ti 3SiC 2/Ti 3AlC 2 joints was determined.
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