Abstract
A GaAs die is attached to a die attach pad on a printed circuit board usually by conductive epoxy or solder paste. Compared to epoxy die attach, direct die solder of GaAs dies onto lead frames have many advantages. Solder offers higher electrical and thermal conductivities, which are important for high power applications. Solder offers higher bonding strength, less die tilting, and less die rotation during die attach process. One of the problems associated with solder die attach is the intermetallic compounds formation between backside metallization of the GaAs die and the solder material. A barrier layer is needed to prevent the intermetallic compound formation at normal operating condition thus failure of the GaAs devices. Such a barrier must have lower electrical resistance, low stress, and must be compatible with current GaAs device manufacturing processes.
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