Abstract

A method for producing a uniform multilayer graphene (MLG) film directly on SiO2 via solid-phase precipitation from carbon-doped cobalt (Co–C) with a Cu capping layer has been developed for a large scale integration (LSI) interconnect application. One advantage is that no transfer process is required. A 20 nm thick MLG film was grown uniformly from a 100 nm thick Co–C (20 at%) catalyst layer with a Cu capping layer. Cross-sectional TEM/EDX images revealed that the optimized Cu capping layer prevents Co agglomeration during annealing and promotes C precipitation on the SiO2 while eliminating it on the top surface of the catalytic metals.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.