Direct chip interconnect using polymer bonding

Abstract

Polymer bonding methods for the direct high-density, fine-pitch interconnection of integrated circuit (IC) components are discussed. Emerging approaches using polymer materials engineered for direct mechanical and electrical connection of ICs are covered. Polymer thick-film (PTF) technology, which has only recently moved from the simple membrane switch arena to the more complex and demanding realm of circuitry, is discussed. Innovative combinations of advanced polymeric materials and techniques with traditional processes have made PTF a leading-edge interconnect technology. Several new polymer bonding methods for directly interconnecting ICs to the circuit are explored, focusing on anisotropic conductive adhesive technology, both for tape automated bonding (TAB) and flip-chip bonding strategies. The use of isotropically conductive and nonconductive polymer bonding agents for direct mechanical and electrical connection of bare die to circuit boards is also examined. Although some of these technologies remain experimental, anisotropic conductive adhesive bonding of electronic components has reached high-volume production status. >