Abstract
A silicon (Si) grain boundary including a glass phase was produced by the bonding of nanometer-sized Si tips which surfaces were coated with glass Si oxide layers inside a 200 kV electron microscope using a piezo-driving specimen holder Atomistic grain boundary sliding was then caused at room temperature The sliding process was directly observed by time-resolved high-resolution transmission electron microscopy at spatial resolution of 0.2 nm and time resolution of 1160 s. The glass phase at the center of the grain boundary showed viscous flow-like deformation during the boundary sliding. The thickness of the glass phase decreased and relative shift of the tips was varied during the grain boundary sliding The internal regions of the Si tips were not deformed plastically or fractured when the thickness of the glass phase was more than about 1 nm corresponding to a few atomic layers. It was shown that the stress introduced during the sliding was relived by the deformation of the glass phase at the boundary.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.