Abstract
We have developed a new technique for measuring the etch rate of polymer films under ablative photodecomposition condition obtained by absorption of the far-UV radiation of the excimer laser. The technique is based on the use of a quartz crystal microbalance interfaced with a microcomputer. It has good accuracy and thus provides precise evidence of a new feature of the etch curve for laser intensity right above the ablation threshold value. Further applications are proposed.
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