Abstract
Lock-in infrared thermography has been identi?ed as a highly suitable technique for a quantitative defect charac-terization. In this work, first, a complete dimensionless reformulation of the thermographic investigation is provided. As a consequence, the constraints of particular experimental setups or material properties can be overcome preserving the full physical information of the experiment. The resulting model has been numerically solved and successfully validated by using experimental thermographic data. Second, the developed dimensionless model has been used as input for a global sensitivity analysis. Overall, the obtained results provide an experimental guideline for an optimized thermographic defect characterization.
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