Abstract

AbstractThis article addresses three different aspects of nano‐scale structure that are important for the implementation of high‐k gate dielectrics, such as HfO2 and Hf Si oxynitride alloys, for advanced gate stack applications ultra large scale integrated (ULSI) circuit and system chips. Two of these deal with nano‐crystalline thin films where it is necessary to make a distinction between the primitive unit cell, and a more extended electronic cell that can support cooperative Jahn‐Teller distortions. The final example relates the bonding coordination of group IVB transition metal (TM) atoms, Ti, Zr and Hf in a ternary composition in which the concentration of four‐fold coordinated TM atoms is above a critical percolation threshold. This is critical for strain relief, thereby promoting low densities of electronically‐active defects. X‐ray absorption spectroscopy studies play a significant role in revealing these important aspects of nano‐structure, and are interpreted with in the frame‐work of many‐electron electronic structure theory. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.