(Digital Presentation) Improving Field-Effect Transistor Performance through Pulsed Laser Irradiation-Mediated MoS2-Metal Contact Engineering

Abstract

Two-dimensional (2D) layered materials, such as MoS2, with their atomically thin characteristics, offer promising novel solutions for the field of nanoelectronics. MoS2 has been identified as a prospective building block for flexible and transparent nanoelectronics in the future, and has the potential to contribute to the continuation of Moore's law by enabling high integration levels with low power consumption. Although the use of 2D semiconductor materials as contact interfaces presents advantages over conventional Si-based metal-semiconductor contacts practical applications still face several obstacles. One of the biggest concerns being is the presence of the large contact resistance which can caps the available field effect carrier mobility making intrinsic quantum transport phenomena in the material inaccessible. In this work, we demonstrate the use of 1064 nm pulsed-laser to selectively anneal the metal contacts of the CVD synthesized MoS2 based back gated FET. The improved metal–semiconductor interface after laser annealing resulted in higher mobility and improved On-Off ratio (10^6~10^7). This selective contact annealing enhanced back gated MoS2 FET overall performance metrics by increasing peak field effect mobility, improving current saturation due to decreased contact resistance.Our findings suggest that Pulsed laser annealing of metal contacts in TMD-based FETs can significantly reduce contact resistivity without causing channel or substrate distortion, which is not possible with conventional thermal annealing. This approach can provide most promising application in the field of high-performance two-dimensional semiconductor in flexible/ wearable electronics. Keywords: TMDCs, CVD, MoS2 FET, laser annealing, contact resistance.