Abstract
The feasibility of micromodule circuitry packaging in tactical digital equipment has been demonstrated by the design, fabrication, and test of MICROPAC (Micromodule Digital Processor And Computer). As a by-product of the MICROPAC program, equipment design techniques for the economical mounting and interconnection of and heat transfer from digital micromodules have been developed and are described herein. It is shown that the circuitry booklet technique of micromodule mounting and interconnection lends itself to efficient heat transfer by forced air cooling, provides for a high packaging density, and permits micromodule interconnection wiring without multilayer wiring. Techniques for the assembly, wiring, and maintenance of high-density digital micromodule equipment have also been developed and are described herein. Finally, it is shown how the 1958 concept of the micromodule as a technique for packaging individual electronic components is advancing toward the 1962 concept of the micromodule as a technique for packaging multiple integrated electronic or solid circuits. The mixture of both concepts or techniques in future militarized digital equipment offers the promise of completely micromodularized digital equipment of high-speed performance, high reliability, and small size at fabrication costs substantially less than those for currently available conventionally packaged digital equipments.
Published Version
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