Abstract
Owing to their great potential to enhance the structural, mechanical, and electrical properties of materials, numerous researchers have dedicated their efforts to manufacturing multi-walled carbon nanotubes (MWCNTs)-reinforced composites via additive manufacturing (AM) to leverage AM's ability to fabricate intricate structural components. However, there is currently limited research on MWCNTs in photosensitive resin (PR) systems processed via a type of vat photopolymerization AM technique - digital light processing (DLP). Additionally, the distribution pattern of MWCNTs in PR systems is still unknown. To address these research gaps, this investigation focuses on fabricating MWCNTs-reinforced PR (MWCNTs-PR) via DLP and studying the effects of MWCNTs content on microstructure characterizations and mechanical properties of MWCNTs-PR. These results show that PR with 0.05 wt% MWCNTs addition exhibits a 25 % increase in elastic modulus and a 2 % increase in bending strength compared to pure PR. To achieve a more uniform distribution of MWCNTs in the PR, a combination of an ultrasonic bath and mechanical stirring was adopted. To further investigate the mechanism behind MWCNTs-enhanced bending resistance, a multi-material layered 3D printing structure was developed. The experimental findings reveal that the 10001 structure yields the highest bending modulus, surpassing the control group by 14.9 %. To validate the bending resistance mechanism attributed to MWCNTs-PR, finite element analysis was conducted.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.