Abstract
A digital domain dynamic path accumulation method for a time-delay-integration (TDI) image sensor that can realize on-chip compensation for image distortion caused by sensor vibration is proposed. Through the proposed method, the exposure signals are controlled to enter the corresponding accumulator according to the vibration vector, ensuring the synchronous accumulation of different stages of pixels on the same object. The behavior level model of the method is established. The structural similarity (SSIM) between images without distortion, distorted images, and images compensated for by the proposed method is simulated and analyzed to verify the effectiveness of the method. Compared with conventional TDI, the SSIM between images with and without vibration is improved from 0.2322 to 0.9858, as the vibration level is 1 pixel per stage. With fixed TDI stages and the vibration level varying from 0 to 2 pixels per stage, the SSIM of conventional TDI drops rapidly to about 0.2 while that of the dynamic path accumulation method maintains at about 0.95. The proposed method is suitable for an antivibration CMOS-TDI image sensor of remote imaging systems.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
