Abstract

The effect of pulse current (PC) on the interdiffusion of Ti-Ni system was investigated under spark plasma sintering. The growth rate of Ni-Ti intermetallics under PC was 3.22 to 6.44 times higher than that with direct current (DC). The reaction activation energy of intermetallics at PC was 18.4 to 79.0 kJ/mol, which is lower than the activation energy of 275.1 to 313.9 kJ/mol at DC; thus, the increased growth rate at PC may have resulted from the decrease of activation energy.

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