Abstract
AbstractThe creep of polycrystalline copper containing a dispersion of silica particles has been investigated at stresses below 1 MN m−2, and at temperatures from 820 to 1120 K. Previous work has shown that pure copper of similar grain size deforms by Coble creep in this regime. The introduction of silica particles is shown to inhibit creep. It is found that the deformation characteristics can be represented by the operation of two coupled processes, one of which can be identified as Coble creep. It is suggested that the other process is the motion of grain-boundary dislocations controlled by the rate at which they can bypass particles. Using this approach it is shown that this can lead to an apparent threshold stress for creep with characteristics similar to those observed by other workers.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
