Abstract
AZ31B Mg alloy and Cu were joined through diffusion bonding using a Zn interlayer film prepared. The element distribution, microstructure and hardness was studied by means of scanning electron microscope(SEM), Energy Dispersive Spectrdmeter (EDS) and Microhardness tester.The result show that SEM results indicate the diffusion zone of Mg/Cu diffusion bonded joint consists of intermetallic compounds. Via enhanced holding time,these intermetallic compounds go steady gradually. Thus the Mg/Cu diffusion bonded joint of strength can be improved. This work provides a theoretical reference and practical experience for Mg/Cu dissimilar metal connection.
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