Diffusion bonding of 410 stainless steel to copper using a nickel interlayer

Abstract

Abstract In the present work, plates of stainless steel (grade 410) were joined to copper ones through a diffusion bonding process using a nickel interlayer at a temperature range of 800–950 °C. The bonding was performed through pressing the specimens under a 12-MPa compression load and a vacuum of 10 − 4 torr for 60 min. The results indicated the formation of distinct diffusion zones at both Cu/Ni and Ni/SS interfaces during the diffusion bonding process. The thickness of the reaction layer in both interfaces was increased by raising the processing temperature. The phase constitutions and their related microstructure at the Cu/Ni and Ni/SS diffusion bonding interfaces were studied using optical microscopy, scanning electron microscopy, X-ray diffraction and elemental analyses through energy dispersive spectrometry. The resulted penetration profiles were examined using a calibrated electron probe micro-analyzer. The diffusion transition regions near the Cu/Ni and Ni/SS interfaces consist of a complete solid solution zone and of various phases based on (Fe, Ni), (Fe, Cr, Ni) and (Fe, Cr) chemical systems, respectively. The diffusion-bonded joint processed at 900 °C showed the maximum shear strength of about 145 MPa. The maximum hardness was obtained at the SS–Ni interface with a value of about 432 HV.