Abstract
Similar and dissimilar material joints of AISI grade 304 (1.4301) and AISI grade 316 (1.4401) austenitic stainless steel by solid state diffusion bonding and transient liquid phase (TLP) bonding are of interest to academia and industry alike. Appropriate bonding parameters (bonding temperature, bonding time, and bonding pressure) as well as suitable surface treatments, bonding atmosphere (usually high vacuum or protective gas) and interlayers are paramount for successful bonding. The three main parameters (temperature, time, and pressure) are interconnected in a strong non-linear way making experimental data important. This work reviews the three main parameters used for solid state diffusion bonding, TLP bonding and to a smaller degree hot isostatic pressing (HIP) of AISI grade 304 and AISI grade 316 austenitic stainless steel to the aforementioned materials (similar joints) as well as other materials, namely commercially pure titanium, Ti-6A-4V, copper, zircaloy and other non-ferrous metals and ceramic materials (dissimilar joints).
Highlights
Diffusion bonding is a solid-state welding technique capable of joining similar and dissimilar materials
Solid state diffusion bonding is attractive for the joining of dissimilar materials since the formation of brittle intermetallic compounds (IMCs) as well as chemical segregation and accumulation of residual stress at the bond interface can be relatively low if compared to other welding techniques [2,3,4]
Transient liquid phase (TLP) bonding differs from solid-state diffusion bonding in a way that a thin interlayer, that has a lower melting point than the base materials and can melt below the bonding temperature, is placed between the base materials that are to be joined
Summary
Diffusion bonding is a solid-state welding technique capable of joining similar and dissimilar materials. The process operates on the principle of solid-state diffusion, wherein the atoms of two solid materials intersperse themselves over time at elevated temperature and pressure so that a high-quality bond between the base materials is formed [1]. Solid state diffusion bonding is attractive for the joining of dissimilar materials since the formation of brittle intermetallic compounds (IMCs) as well as chemical segregation and accumulation of residual stress at the bond interface can be relatively low if compared to other welding techniques [2,3,4]. Transient liquid phase (TLP) bonding differs from solid-state diffusion bonding in a way that a thin interlayer, that has a lower melting point than the base materials and can melt below the bonding temperature, is placed between the base materials that are to be joined. A bond that has a higher melting point than the initial TLP bonding
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