Diffusion behaviour of Au/Ni bilayers deposited by electron beam evaporation and sputtering onto massive copper substrates

Abstract

We have studied the diffusion behaviour of Au/Ni bilayers deposited onto massive copper substrates by electron beam evaporation and sputtering. The structure of the gold films is characterized by transmission electron microscopy. The diffusion of Ni through Au and of Cu through the Au/Ni bilayer is controlled by Auger spectroscopy using the method of the “first arrival”. Diffusion annealings were performed between 300 and 400 °C. The results are discussed in relation with the structure of the films. It appears that a small deposition rate favours single crystal areas in the deposited film and consequently makes a more effective diffusion barrier.