Abstract
Reflow behavior of Sn-Zn solder on Ni/Cu substrate was investigated in an infrared (IR) reflow furnace using different heating rates from 180 °C/min to 36 °C/min. Energy dispersive spectroscopy (EDX) studies of the reflowed samples showed increased diffusion of Zn from the solder to the intermetallic compound (IMC) layer with a decrease in heating rate. Higher interfacial activity and affinity of the Zn in the formation of the IMC with the lowering of the heating rate were further demonstrated by electron probe microanalyzer (EPMA) results. The Zn diffusion behavior was related to its higher reactivity and smaller size in comparison with Sn, phase separation during heating, and affinity of Zn to form Ni-Sn-Zn and Ni-Zn intermetallic compounds.
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