Abstract
The Diffuse Infrared Background Experiment (DIRBE) optics module will be assembled at ambient temperature but will operate at liquid helium temperature. The challenging task of ensuring that is possible to maintain alignment through cryogenic cooling and cryogenic vibration has been demonstrated in a DIRBE optics module breadboard program. This paper discusses the configuration of the DIRBE optics module breadboard, ambient temperature optical alignment methods used to assemble the breadboard, and cryogenic testing of the breadboard. The alignment of the optical assembly at ambient temperature, at 77 K, and after a 77 K vibration was within specification.
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