Abstract
High voltage capacitors are key components for transient storage and release of electrical energy in mobile electric devices, electric vehicles, stationary power systems and power transmission. Due to their high electric breakdown voltage, self-healing capability and affordability, polymer-based film capacitors are widely used, particularly those made from biaxially oriented polypropylene (BOPP). Their maximum operating temperature near 100°C, however, requires careful thermal management and oversize design. In high temperature applications well above 200°C, the preference shifts from organic to ceramic dielectric materials. Multilayer ceramic capacitors (MLCCs) are known for their excellent mechanical and thermal robustness, have a mature fabrication technology and have found a wide spectrum of applications in power electronic systems. Their higher cost level is frequently over-compensated by their robustness, a unique selling point particularly in high temperature applications. The present investigation deals with the suitability of various ceramic materials like mica, several high and low temperature sinterable tapes (HTCC, LTCC) as well as atmospheric plasma-sprayed (APS) alumina under such conditions. Aspects of manufacturability and component design are taken into account as well. Dielectric materials performance is particularly addressed by high temperature impedance spectroscopy up to several hundred °C to minimize further self heating of the components above the operating temperature. Although these materials, commercial as well as non-commercial ones, were originally developed for either electric or high temperature applications, the analysis suggests promising materials choices also in cases, when both requirements come together. Although dissipation factors obtained from capacitive test structures cover a wide range, capacitors made from pure alumina (HTCC) generally have lower dielectric loss at all temperatures than those made from glass-ceramic composites (LTCC). Quite diverse properties are obtained with APS alumina, which would represent a promising fabrication alternative due to the possible solid deposition on metal surfaces.
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More From: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
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