Dielectric, thermal and mechanical properties of Sr2ZnSi2O7 based polymer/ceramic composites

Abstract

Polymer/Sr2ZnSi2O7 (SZS) ceramic composites suitable for substrate applications have been developed using the polymers polystyrene (PS), high density polyethylene (HDPE) and Di-Glycidyl Ether of Bisphenol A (DGEBA). The dielectric, thermal and mechanical properties of the composites are investigated as a function of various concentrations of the ceramic filler. The obtained values of relative permittivity, dielectric loss tangent, thermal conductivity and coefficient of thermal expansion of the composites are compared with the corresponding theoretical predictions. The relative permittivity of the polymer/ceramic composites increases with filler loading. The dielectric loss tangent also shows the same trend except for DGEBA/SZS composites. The major advantages of the ceramic loading are improvement in thermal conductivity and a decrease in the coefficient of thermal expansion. The tensile strength of the composites decreases with increase in filler content, whereas an improvement is observed in microhardness. The variation of relative permittivity (at 1 MHz) of the composites is also studied as a function of temperature.