Abstract
AbstractSummary: Polyimide‐mica hybrid films were prepared via ultrasonic dispersion and in situ polymerization process from a solution of a polyimide precursor and mica in N,N‐dimethylacetamide, and their structure was characterized by FTIR and XRD techniques. The dependence of dielectric properties, such as dielectric constant and electrical breakdown strength, of the hybrid films on the content of mica was studied at room and cryogenic temperatures. The results show that the dielectric constant of PI‐mica hybrid films decreases with the increase of the mica content at temperatures from −150 to 150 °C and at frequency range from 1 kHz to 1 MHz. It was found that the cryogenic electrical breakdown strength of the PI‐mica hybrid films could meet the requirements of cryogenic insulating materials.Effect of frequency on the dielectric constant of PI‐mica hybrid films at 140 °C at the frequency from 1 kHz to 1 MHz.magnified imageEffect of frequency on the dielectric constant of PI‐mica hybrid films at 140 °C at the frequency from 1 kHz to 1 MHz.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.