Abstract
In this paper, the influence of interpenetrating polymer network (IPN) introduction on the dielectric properties, heat proof properties, internal structure and defects of the Epoxy/SiO/sub 2/ composite materials, were investigated. We reported a relation between network structure and electrical properties, especially dielectric properties with variation of network structures for epoxy composite materials. According to experimental results, the samples, which have single network structures, have lower dielectric constant than IPN samples, but have relatively larger dependency to variation of temperature and frequency. It was confirmed that introducing of IPN insulating materials attains change of structures. Therefore it is counted that introduction of multiple structure including IPN is necessary to improve heat proof and electrical properties.
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