Abstract
Low temperature co-fired ceramics (LTCC) technology becomes crucial in the development of various modules and substrates in electronic packaging, especially in wireless and microwave applications [. With this technology, passive components (such as capacitors and inductors) can be embedded into substrates, and co-fired with high-conductive metals (such as silver and copper) below 900°C. Therefore, the shringkage and dielectric properties of LTCC are of great importance to the performance of components. So far, ceramic/glass composites have been widely researched for LTCC application due to tailored physical properties and low sintering temperature [2-3].
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