Abstract
Polypropylene has been widely used as dielectric material in organic thin-film capacitors due to their high breakdown strength, low dielectric loss and self-healing capability. However, polypropylene’s energy density is relatively low. Increasing the energy density of polypropylene by adding materials with a high dielectric constant is commonly used. Still, it often leads to an increase in dielectric loss, lower dielectric strength and other shortcomings. In this study, a thin 2D platelet of mica/graphene oxide composite material was made from exfoliated mica as a substrate and attached by graphene oxide. The mica/graphene oxide platelets were added to polypropylene to make a plastic dielectric composite. The non-conductive flat inorganic additive can increase the dielectric constant and dielectric strength of the composite without increasing dielectric loss. The tiny mica/graphene oxide platelets can significantly improve the dielectric properties of polypropylene. The results show that by adding a small amount (less than 1 wt%) mica/graphene oxide, the relative dielectric constant of polypropylene can increase to more than 3.7 without causing an increase in dielectric loss and the dielectric strength of polypropylene can also enhance.
Highlights
Dielectric materials are widely used in electronics devices and systems [1,2,3,4,5]
It can be found that the addition of mica and a small amount of graphene oxide increases the dielectric strength of polypropylene compared to the result of PP raw materials
The engineering tensile stress-strain curves of PP, mica/PP and mica/graphene oxide/PP films are shown in Figure 10, from which the elongation of polypropylene is over 50% and the ultimate tensile strength (UTS) is 17.8 MPa
Summary
Dielectric materials are widely used in electronics devices and systems [1,2,3,4,5]. Dielectric materials’ performance requires consideration of multiple characteristics such as dielectric constant (k or ε), dielectric loss (tan δ) and dielectric strength. Different applications will require different dielectric materials [6]. IC insulation materials with a low dielectric constant are required, dielectrics with high dielectric strength and low loss are necessary under a high electric field application. The dielectric used can be gas, liquid and solid state, for solid dielectrics, both polymers and ceramics are common dielectric materials. Polymers have benefits such as flexibility, low process temperature and high breakdown voltage but usually with a small dielectric constant (mostly less than 10). Combining different materials as composites have been widely studied because composites can integrate other materials’ unique properties to produce specific properties to meet the different needs [7,8]. Many studies combine polymer and ceramics to be polymer-based composites as dielectrics, usually by filling a flexible polymer matrix with isolated particles of inorganic compounds to increase dielectric constant [9,10,11,12,13]
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