Abstract
A novel bismaleimide (BMI), bis(4-maleimidophenoxy-3,5-dimethylphenyl)dicyclopentadiene (DCPDBMI), containing a large dicyclopentadiene (DCPD) and aryl ether linkage, was synthesized from bis(4-aminophenoxy-3,5-dimethylphenyl)dicyclopentadiene and maleic anhydride by the usual two-step procedure that included ring-opening addition to give bismaleamic acid, followed by cyclodehydration to bismaleimide. The monomers were characterized by Fourier transform infrared spectroscopy (FT-IR), proton nuclear magnetic resonance (NMR), elemental analyses (EA), and mass spectra (MS). A series of bismaleimide-triazine (BT) resins were prepared from synthesized bismaleimide (DCPDBMI) and then cured with 2,6-dimethyl phenol-dicyclopentadiene dicyanate ester (DCPDCY) at various molar ratios. Thermal properties of cured BT resins (DCPDBMI/DCPDCY) were studied using dielectric analyzer (DEA), dynamic mechanical analyzer (DMA) and thermalgravimetric analyzer (TGA). These data were compared with that of commercial bismaleimide (DDMBMI) cured with bisphenol A dicyanate ester (BADCY). The cured DCPDBMI/DCPDCY exhibits lower dielectric constant, dissipation factor and moisture absorption than those of DDMBMI/BADCY. The effects of blend composition on the glass transition temperatures and thermal stability are discussed.
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