Die-Attach Voiding Reduction in Gold Alloy Solder Preforms

Abstract

Abstract The need for high-temperature solders is growing as RF and power semiconductor devices continue to get smaller, with power density increasing both as a consequence of the shrink and as a result of increased power ratings. AuSn20 eutectic solder (Indalloy®182) has been the workhorse for high-temperature, high-reliability, small die-attach applications for many years; however, as junction temperatures (Tj) increase, the gold-tin eutectic is beginning to reach its limit of utility. Higher temperatures cause increased thermal fatigue, and even delamination is seen at the solder joints. The next option for RF and power semiconductor manufacturers needing these higher temperatures is either AuGe12 (Indalloy®183) or AuSi3.2 (Indalloy®184) eutectic alloy (see Table I).Table 1.Key properties of Au-based eutectic alloys. Over the years, many customers have tried AuGe12 and the feedback has been that the alloy has poor solderability, which manifests as large voids in the bond. Voids are poor conductors of heat, which create hot spots, and are the primary cause of premature failures.