Abstract
This article introduced the technologies of die to package .these mainly including wire bonding(WB),tape-automated bonding(TAB),and flip chip(FC).the most common wire bonding technique is ball bonding. This is the foundation of the others .at the end parts, the paper illustrated the new interconnection technology -TSV, it bring us from 2D to 3D interconnection times. Wire bonding Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one PCB to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages.
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