Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres

Abstract

Isotropic conductive adhesives (ICAs) filled with metal-coated polymer spheres (MPS) are introduced to improve the mechanical reliability compared with conventional ICAs filled with silver (Ag) flakes. This paper deals with the die shear performance of an MPS-based ICA; an epoxy filled with 45 vol% of Ø30 μm Ag-coated monodisperse polymer spheres. The curing kinetics of the ICA is also studied. The MPS-based ICA is compared with two ICAs filled with Ag flakes: an in-house prepared ICA (with the same epoxy matrix as the MPS-based ICA) and a commercially available ICA. Both ICAs with Ag flakes have a lower particle volume fraction than the MPS-based ICA. Loading 45 vol% of MPS into the epoxy matrix has no significant effect on the curing kinetics and the glass transition temperature (Tg) of the matrix. The MPS-based ICA has 140% higher die shear strength than the in-house prepared ICA with Ag flakes, and 23% higher die shear strength than the commercial ICA with Ag flakes. The MPS-based ICA also has higher shear strain at failure, and less scatter in shear strength between repeated tests. Hence, the MPS-based ICA has a good potential for demanding applications; it has better die shear performance and higher T <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">g</sub> than the commercial ICA with Ag flakes.