Abstract
Improvement on the process and design is often a reliable way to resolve a problem especially in semiconductor industry. This paper presents a leadframe or semiconductor carrier merged with a stand-off design structure that will maintain a consistent bond line thickness (BLT) criteria for quad-flat no-leads (QFN) packages. Through package and process conceptualization, the stand-off design located on the leadframe underneath the silicon die corners would result to a steady and consistent BLT during die attach process. With the improved design, die tilt occurrence in die attach process would be mitigated.
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