Abstract
Different chemical etching procedures (CF 4 plasma, Aqua regia, and two-step Murakami/Aqua regia) were compared as surface pre-treatments for CVD diamond deposition onto sub-micrometric WC–Co hardmetal grades with cobalt contents of 3.5 and 5.75 wt% Co. Adhesion tests by static indentation up to 1100 N revealed the superior behaviour of the latter when pre-treated by the combined two-step etching for which no film spalling-off is observed at the maximum applied load. An interfacial crack resistance of about 1.6 kgf/μm was estimated anticipating high adhesion levels.
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