Abstract
Spin transfer torque-based magnetic random access memory (STT-MRAM) is considered as one of the most promising candidates for the next generation of nonvolatile memories; however, its storage density and reliability are currently uncompetitive compared with other nonvolatile memories (e.g., NAND flash). In this paper, a dual-functional memory cell structure, named DFSTT-MRAM, is proposed by stacking multiple magnetic tunnel junctions (MTJs) on top of the CMOS access transistor. In such a structure, the cell can be dynamically configured between two possible functional modes, i.e., high-reliability mode (HR-mode) and multilevel cell mode (MLC-mode), based on the data requirements of the addressed applications. The DFSTT-MRAM cell was electrically modeled based on the perpendicular magnetic anisotropy CoFeB/MgO/CoFeB MTJ integrating the STT stochastic switching behaviors. Transient and Monte Carlo simulations were then performed to evaluate its MLC functionality and reliability performance. Our evaluation results show that the DFSTT-MRAM cell can indeed realize MLC capability providing proper write/read control at the MLC-mode and enhance the intrinsic cell reliability by several orders of magnitude when operating at the HR-mode. This cell structure provides a flexible memory cell design for future advanced applications, such as high-density nonvolatile memory and neuromorphic circuits.
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