Abstract
With the fast development of the fifth-generation cellular network technology (5G), the future sensors and microelectromechanical systems (MEMS)/nanoelectromechanical systems (NEMS) are presenting a more and more critical role to provide information in our daily life. This review paper introduces the development trends and perspectives of the future sensors and MEMS/NEMS. Starting from the issues of the MEMS fabrication, we introduced typical MEMS sensors for their applications in the Internet of Things (IoTs), such as MEMS physical sensor, MEMS acoustic sensor, and MEMS gas sensor. Toward the trends in intelligence and less power consumption, MEMS components including MEMS/NEMS switch, piezoelectric micromachined ultrasonic transducer (PMUT), and MEMS energy harvesting were investigated to assist the future sensors, such as event-based or almost zero-power. Furthermore, MEMS rigid substrate toward NEMS flexible-based for flexibility and interface was discussed as another important development trend for next-generation wearable or multi-functional sensors. Around the issues about the big data and human-machine realization for human beings’ manipulation, artificial intelligence (AI) and virtual reality (VR) technologies were finally realized using sensor nodes and its wave identification as future trends for various scenarios.
Highlights
The microelectromechanical systems (MEMS) is the integration of electrical and mechanical components at the nanoscale and microscale dimensions [1,2,3,4]
With the rapid development of information industry and human-machine interface technology in the information industry and human-machine interface technology in the fifth-generation cellular network fifth-generation cellular network technology (5G), virtual reality (VR) technology, and augmented technology (5G), virtual reality (VR) technology, and augmented reality (AR) technology have become reality (AR) technology have become a hot research topic when combined with MEMS/nanoelectromechanical systems (NEMS)
Along with the development that the 3D MEMS structure consisted of microcantilever resonators of identical lengths with of this technology, soft lithography using an elastomeric stamp was developed with its methods continuously varying release lengths
Summary
The microelectromechanical systems (MEMS) is the integration of electrical and mechanical components at the nanoscale and microscale dimensions [1,2,3,4]. Among different kinds of MEMS-based sensors, the advantages of the silicon sensors involve their small size, high signal-to-noise ratio, low hysteresis, ability to work in an extreme environment, and high repeatability in their fabrication Due to these advantages, the conventional MEMS sensors were widely applied to automation, aeronautics, consumer electronics, defense, industrial manufacture, medical equipment, life science, and telecommunication [17,18,19]. Toward the wearable sensing application, we observed the development trends from the conventional rigid silicon-based sensors to the flexible-based sensors, such as the functional materials textile in the wearable electronics.
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