Abstract
A new all-silicon multichip module with integrated thermal management system is presented. Our new packaging approach combines the benefits of wafer-scale integration with the flexibility of independently fabricated and pre-tested devices, allowing the development of highly integrated systems. Wet anisotropic etching is used for the dicing of silicon integrated circuits as well as for the fabrication of the chip-receiving cavities in the silicon substrate. The etching exposes {1 1 1} type planes in both chip and receiving surface, assuring a virtually perfect mating of the assemblage. The system is complemented with an integrated silicon heat sink, which can maintain heat fluxes in excess of 100 W/cm2.
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