Development of Thermal Test Package for Data Center Micro-Fluid Cooling Characterization

Abstract

Thermal test package has been designed to mimic the thermal performance of mainstream processor used in data center for micro-fluid cooling characterization. The target heat power of the test chip is $\gt$150W for characterization. Platinum (Pt) heaters and temperature sensors have been designed in thermal test chip. Regarding meander heat line, three types of structure have been designed while maintaining same total electrical resistance in each chip. To fabricate the thermal test chip, 5 masks have been designed and prepared. Pt heaters and sensors have been fabricated simultaneously using DC sputtering process. The thermal test chips located at different positions in one wafer are measured, and the sensors located at different positions in the chips are tested as well. Results show that average resistances of heater and sensor are 300$\Omega$ and 1075$\Omega$ respectively, and errors are within ±5%. The thermal test packages work quite well at high heating power in the cooling solution characterization tests