Abstract
This paper describes the development of a new MEMS-based optical mirror, which can perform optical switching (or scanning) function with discrete reflection angles in an outof- plane configuration. The device is fabricated through the Deep Reactive Ion Etching (DRIE) process on silicon-on-insulator (SOI) wafer, followed by wafer dicing and assembly with two metalised glass dies. The MEMS mirror can be tilted under electrostatic force between the opposite electrodes embedded on SOI and glass structures. The most outstanding feature of this MEMS mirror is the discrete and therefore, reliable tilting angles, which generated by its unique mechanical structural design and electrostatic-driven mechanism. In this paper, the concept of the new scanning mirror is presented, followed by the introduction of device design, mechanical simulation, microfabrication process, assembly solution, and some testing results. The potential applications of this new MEMS mirror include optical scanning, optical sensing (or detection), and optical switching.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
