Abstract
Recently semiconductor packages with redistribution layers are gathering attention because of its electrical performance and low energy consumption. Dielectric materials for these packages require low-temperature curability to avoid thermal damage of devices and thermally unstable materials in the packages. Low-temperature curable positive-tone photodefinable material AH-3000 was developed and its reliabilities were evaluated. AH-3000 kept good mechanical properties after reliability test. AH-3000 is also applicable to slit coating, which is required for next-generation panel level package.
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