Development of Patterns for Digital Image Correlation Measurements at Reduced Length Scales

Abstract

Methods for patterning metal thin films at the microscale and nanoscale by applying the patterns to metallic and polymeric materials for use in shape and deformation measurements in a scanning electron microsope (SEM) or other high magnification imaging system are described. In one approach, thin films of metallic materials (e.g., Au, Ag, Cu, and Cr) are applied to a variety of substrates. The coated samples are then placed into a reaction vessel, where the specimens are heated and exposed to a nitrogen atmosphere saturated with selected volatile chemicals. This process results in nano-scale remodeling of the metallic films, thereby affording high contrast random patterns with different morphologies. In a second approach, thin films of metallic materials, including gold and silver, also have been applied using a simplified UV photolithographic method requiring a minimum amount of laboratory preparation. Using selected substrates, both methods have been used successfully to transfer patterns onto polymeric and metallic materials ranging from 50–500 nanometers with chemical vapor rearrangement and 2 to 20 microns with UV photolithography, providing a pattern that can be used with digital image correlation to quantify both the surface profile and also surface deformations at reduced length scales.