Abstract
Low temperature co-fired ceramics (LTCC) cavity technique is an excellent packaging solution to realize integration of microwave interconnecting substrate and packaging house with lower cost for developing microwave multichip modules (MMCMs) for phased-array antennas. Development of microwave hermetic packages with LTCC cavity structure was described in detail in this paper. The microwave LTCC cavity structures were analyzed, and the LTCC cavity transition structures were simulated and optimized by using the microwave analysis software. The manufacturing process for LTCC cavity was studied and the microwave hermetic packages using LTCC cavity was developed successfully. Good agreement was acquired between the simulated results and the experimental results. (4 pages)
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