Development of methods for formation and testing of photoresist films with a desired thickness profile when fabricating conformal correctors

Abstract

A process of manufacturing conformal correctors for solid state YAG:Nd3+ lasers is discussed. It is proposed that a maskless lithography method should be used for fabricating a photoresist film with a desired thickness profile as an alternative to the proximity lithography based on half-tone masks. The use of a specular spectral scatterometry method for the testing of the conformal corrector shape at an early stage of photoresist profile formation is reported. A combination of these two methods makes the corrector manufacturing process significantly cheaper and faster.