Abstract
This paper will discuss the fundamental study on nano-silver pastes newly developed with a unique approach using MO (Metallo-organic) technology. MO technology provides a low-temperature sintering capability. The nano-silver pastes show high electrical and thermal performance. However, degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Additionally, lowering modulus technology has been developed. By adding thermoplastic resin particles to the pastes, the reliability can be improved because the resin reduces the stress caused by the CTE mismatch between the die and substrate.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
